An Experimental Investigation on the Properties of Two Novel Ternary Solder Alloys Sn–0.5Cu–3Bi and Sn–1Cu–1Ni Replacing Lead

Author:

Jayesh S.,Jacob E.

Publisher

Pleiades Publishing Ltd

Subject

Materials Chemistry,Condensed Matter Physics

Reference21 articles.

1. H. H. Manko, Solder and Soldering, 2nd Ed. (McGraw-Hill, New York, 1979).

2. M. Schwartz, Soldering: Understanding the Basics, First edition (ASM International, Metals Park, 2014).

3. NCMS Lead-Free Solder Project Final Report, NCMS, National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, Michigan 48108-3266, Report 0401RE96, August 1997.

4. COM (2000) 347-2: European Parliament. Proposal for a Directive of the European Parliament and of the Council on Waste Electrical and Electronic Equipment and on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

5. T. P. Vianco, “Development of alternatives to lead-bearing solders,” in: Proceedings of the Technical Program on Surface Mount International, 19 August–2 September 1993, San Jose, CA.

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