Author:
Chukhlanov V. Yu.,Selivanov O. G.,Chukhlanova N. V.
Subject
Polymers and Plastics,General Chemical Engineering,General Chemistry
Reference10 articles.
1. V. Yu. Chukhlanov and E. N. Tereshina, “Polyorganosiloxane-based heat-resistant sealant with improved dielectric characteristics,” Polym. Sci., Ser. D 49 (3), 288–291.
2. L. G. Aleksandrova, “Adhesive materials in the production of glad dielectrics for printed circuits,” Polym. Sci., Ser. D 6 (1), 54–58 (2013).
3. E. M. Wouterson, F. Y. Boey, X. Hu, and S. C. Wong, “Specific properties and fracture toughness of syntactic foam: Effect of foam microstructures,” Compos. Sci. Technol., No. 65, 1840–1847 (2005).
4. A. F. Yarullin, L. E. Kusnetsova, A. F. Yarullina, and O. V. Stoyanov, “Electrophysicalproperties of oligomer-polymer complexes based on heat-resistant oligoaryleneamines,” Polym. Sci., Ser. D 6 (2), 109–115 (2013).
5. V. Yu. Chukhlanov and O. G. Selivanov, “Dielectric properties of the sealant composition based on epoxidian resin modified by polymethylphenylsiloxane, in centimeter microwave range,” Klei, Germetiki, Tekhnol., No. 3, 6–10 (2015).
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献