Influence of the Passivation Layers on the Self-Heating Effect in the Double Channel AlGaN/GaN MOS-HEMT Device
Author:
Publisher
Pleiades Publishing Ltd
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1134/S1063739723700233.pdf
Reference23 articles.
1. Sheppard, S., Doverspike, K., Pribble, W.L., Allen, S.T., Palmour, J.W., Kehias, L.T., and Jenkins, T.J., High-power microwave GaN/AlGaN HEMTs on semi-insulating silicon carbide substrates, IEEE Electron Device Lett., 1999, vol. 20, no. 4, pp. 161–163. https://doi.org/10.1109/55.753753
2. Mishra, U.K., Wu, Yi-F., Keller, B.P., and Denbaars, S.P., GaN microwave electronics, IEEE Trans. Microwave Theory Tech., 1998, vol. 46, no. 6, pp. 756–761. https://doi.org/10.1109/22.681197
3. Santhakumar, R., Thibeault, B., Higashiwaki, M., Keller, S., Chen, Zh., Mishra, U.K., and York, R.A., Two-stage high-gain high-power distributed amplifier using dual-gate GaN HEMTs, IEEE Trans. Microwave Theory Tech., 2011, vol. 59, no. 8, pp. 2059–2063. https://doi.org/10.1109/TMTT.2011.2144996
4. Touati, Z-e., Hamaizia, Z., and Messai, Z., DC and RF characteristics of AlGaN/GaN HEMT and MOS-HEMT, 4th Int. Conf. on Electrical Engineering (ICEE), Boumerdes, Algeria, 2015, IEEE, 2015, pp. 1–4. https://doi.org/10.1109/INTEE.2015.7416850
5. Dong, Zh., Wang, J., Wen, C.P., Gong, D., Li, Yi., Yu, M., Hao, Yi., Xu, F., Shen, B., and Wang, Ya., High breakdown AlGaN/GaN MOSHEMT with thermal oxidized Ni/Ti as gate insulator, Solid-State Electron., 2010, vol. 54, no. 11, pp. 1339–1342. https://doi.org/10.1016/j.sse.2010.06.001
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