Possibilities of thick films of microelectronics in the development of the circuitry of radio engineering systems (Review)-Reference-Cited by-同舟云学术

Possibilities of thick films of microelectronics in the development of the circuitry of radio engineering systems (Review)

Published:2013-09 Issue:5 Volume:42 Page:276-287
ISSN:1063-7397
Container-title:Russian Microelectronics
language:en
Short-container-title:Russ Microelectron

Author:

Podvigalkin V. Ya.

Publisher

Pleiades Publishing Ltd

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1134/S1063739713050053.pdf

Reference22 articles.

1. Netrebenko, K.A. and Reutov, V.B., Analogo-tsifrovye preobrazovateli dlya rezistornykh datchikov (Analog-to-Digital Converters for Resistive Sensors), Moscow: Energiya, 1975.

2. Topfer, M.L., Thick Film Microelectronics: Fabrication, Design and Applications, Van Nostrand Reinhold, 1971.

3. Palachev, Yu.M., Evolution of computer designs with applying the unpacked circuitry, Elektron. Tekh., Ser. 10. Mikroelektron. ustroistva, 1979, no. 6(18), pp. 12–17.

4. Amirov, Yu.D., Alferova, T.K., Volkov, P.N., et al., Tekhnologichnost’ konstruktsii izdeliya: Spravochnik (Manufacturability of the Ware Design: Handbook), Amirov, Yu.D., Ed., Moscow: Mashinostroenie, 1990.

5. Vozhenin, I.N., Mikroelektronnaya apparatura na beskorpusnykh integral’nykh mikroskhemakh (Microelectronic Equipment Based on Unpacked Integrated Microcircuits), Vozhenin, I.N., Ed., Moscow: Radio i Svyaz’, 1985.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel Ballistic Processing of Sn-0.7Cu Thick Films;Metallurgical and Materials Transactions A;2016-11-01