Study of the Influence of Mechanical and Temperature Effects on the Level of Stresses and Deformations in 3D Microassemblies Hermetically Sealed with Two Types of Compounds-Reference-Cited by-同舟云学术

Study of the Influence of Mechanical and Temperature Effects on the Level of Stresses and Deformations in 3D Microassemblies Hermetically Sealed with Two Types of Compounds

Published:2022-12 Issue:7 Volume:51 Page:531-538
ISSN:1063-7397
Container-title:Russian Microelectronics
language:en
Short-container-title:Russ Microelectron

Author:

Vertyanov D. V.,Belyakov I. A.,Pogudkin A. V.,Timoshenkov S. P.,Sidorenko V. N.

Publisher

Pleiades Publishing Ltd

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1134/S1063739722070137.pdf

Reference16 articles.

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2. 2002, Toulouse, France, Noordwijk: ESA Publ. Div., 2002, p. 213.

3. Fedorov, M., High-tech 3D Plus memory chips, Kompon. Tekhnol., 2006, no. 9 (62), pp. 72–75.

4. Albert, D. and Gann, K., Stackable microcircuit layer formed from a plastic encap-sulated microcircuit and method of making the same, US Patent no. US20020100600A1, 2002.

5. Wafer Level Packaging reaches new heights. http:// www.yole.fr/Advanced_Packaging_Monitor_Q1.aspx. Accessed November 24, 2021.

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