Physical and Technological Characteristic Features of the Process of Installation of Dies onto a Temporary Foundation in Internal Wiring Technology

Author:

Vertyanov D. V.,Korobova N. E.,Pogudkin A. V.,Kravtsova V. D.

Publisher

Pleiades Publishing Ltd

Subject

Physics and Astronomy (miscellaneous)

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Problems of Microsystems Reliability Design with Redistribution Layers in Wafer Level Packaging;2024 IEEE 25th International Conference of Young Professionals in Electron Devices and Materials (EDM);2024-06-28

2. Analysis and Modeling of Thermo mechanical Deformations and Stresses in Redistribution Layers in the Fan-out Wafer Level Packaging;2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME);2023-07-19

3. Electroluminescence in p-GaP/por-GaP/SnO2 Structures in the Red Region of the Spectrum;Russian Microelectronics;2022-12

4. Effects of Multilayer Structures Made of Epoxy Compounds with Different Filler Contents on Thermo-Mechanical Stresses in 3D packages;2021 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus);2021-01-26

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