Retardation of O diffusion through polycrystalline Pt by Be doping
Author:
Publisher
American Physical Society (APS)
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevB.59.16047/fulltext
Reference24 articles.
1. Thin‐film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries
2. Platinum alloys and iridium bottom electrodes for perovskite based capacitors in dram applications
3. A review of high dielectric materials for DRAM capacitors
4. Investigation of Pt/Ta diffusion barrier using hybrid conductive oxide (RuO[sub 2]) for high dielectric applications
5. Ab initiomolecular dynamics for liquid metals
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