Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers-Reference-Cited by-同舟云学术

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Enhancement of Thermal Conductance at Metal-Dielectric Interfaces Using Subnanometer Metal Adhesion Layers

Published:2016-01-26 Issue:1 Volume:5 Page:
ISSN:2331-7019
Container-title:Physical Review Applied
language:en
Short-container-title:Phys. Rev. Applied

Author:

Jeong Minyoung,Freedman Justin P.,Liang Hongliang Joe,Chow Cheng-Ming,Sokalski Vincent M.,Bain James A.,Malen Jonathan A.

Funder

National Science Foundation

DSSC

Publisher

American Physical Society (APS)

Subject

General Physics and Astronomy

Link

http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevApplied.5.014009/fulltext

Reference57 articles.

1. Quantum Spin Hall Effect in Graphene

2. Topological insulators in Bi2Se3, Bi2Te3 and Sb2Te3 with a single Dirac cone on the surface

3. Colloquium: Topological insulators

4. Modification and Control of Topological Insulator Surface States Using Surface Disorder

5. Heat-assisted magnetic recording by a near-field transducer with efficient optical energy transfer

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