Polarity Effect of Electromigration in Ni2Si Contacts on Si
Author:
Publisher
American Physical Society (APS)
Subject
General Physics and Astronomy
Link
http://harvest.aps.org/v2/journals/articles/10.1103/PhysRevLett.76.2346/fulltext
Reference17 articles.
1. Electromigration in Al(Cu) two‐level structures: Effect of Cu and kinetics of damage formation
2. Effects of microstructure on interconnect and via reliability: Multimodal failure statistics
3. Electromigration‐induced drift failure of via contacts in multilevel metallization
4. Electromigration in metals
5. Comparison of Al electromigration in conventional Al alloy and W‐plug contacts to silicon
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3. Coaxial Metal-Silicide Ni2Si/C54-TiSi2 Nanowires;Nano Letters;2012-04-09
4. Current-Induced Degradation of Nickel Ohmic Contacts to SiC;Journal of Electronic Materials;2009-01-24
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