Analysis of electromagnetic forming process using sequential electromagnetic-structural coupling simulation-Reference-Cited by-同舟云学术

Analysis of electromagnetic forming process using sequential electromagnetic-structural coupling simulation

Published:2015-10-19 Issue:2 Volume:49 Page:263-278
ISSN:1383-5416
Container-title:International Journal of Applied Electromagnetics and Mechanics
language:
Short-container-title:JAE

Author:

Kim Jeong¹,Noh Hak-Gon¹,Song Woo-Jin²,Kang Beom-Soo³

Affiliation:

1. Department of Aerospace Engineering, Pusan National University, Gumjung-ku, Busan, Korea

2. Industrial Liaison Innovation Cluster, Pusan National University, Gumjung-ku, Busan, Korea

3. ERC/ITAF, Pusan National University, Gumjung-ku, Busan, Korea

Publisher

IOS Press

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

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