Characterization of polymer/epoxy buried interfaces with silane adhesion promoters before and after hygrothermal aging for the elucidation of molecular level details relevant to adhesion-Reference-Cited by-同舟云学术

Characterization of polymer/epoxy buried interfaces with silane adhesion promoters before and after hygrothermal aging for the elucidation of molecular level details relevant to adhesion

Published:2015 Issue:128 Volume:5 Page:105622-105631
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Ulrich Nathan W.¹²³⁴,Myers John N.¹²³⁴,Chen Zhan¹²³⁴

Affiliation:

1. Department of Chemistry

2. University of Michigan

3. Ann Arbor

4. USA

Abstract

Buried interfacial structures containing epoxy underfills are incredibly important in the microelectronics industry and their structures determine the interfacial adhesion properties and ultimately their lifetime.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA24332G

Reference55 articles.

1. Microelectronics packaging: present and future

2. Recent advances in hermetic equivalent flip-chip hybrid IC packaging of microelectronics

3. Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications

4. M. K. Rahim , J. C.Suhling, R. C.Jaeger and P.Lall, Fundamentals of delamination initiation and growth in flip chip assemblies, in Proc. 55th Electron. Compon. Technol. Conf., 2005, pp. 1172–1185

5. STUDY ON PROPERTY OF UNDERFILL BASED ON EPOXY CURED WITH ACID ANHYDRIDE FOR FLIP CHIP APPLICATION

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