Ultraviolet Light-Sensitive Debonding Layer for Reducing Adhesion of Polymer Adhesives for Recycling-Reference-Cited by-同舟云学术

Ultraviolet Light-Sensitive Debonding Layer for Reducing Adhesion of Polymer Adhesives for Recycling

Published:2022-10-26 Issue:44 Volume:126 Page:18907-18917
ISSN:1932-7447
Container-title:The Journal of Physical Chemistry C
language:en
Short-container-title:J. Phys. Chem. C

Author:

Andre John S.¹^ORCID,Escoffery Najae¹,Ulrich Nathan W.¹^ORCID,Wu Yuchen¹²,Guo Wen¹,Yang Mengshijie¹,Myers John¹,Chen Zhan¹²^ORCID

Affiliation:

1. Department of Chemistry, University of Michigan, 930 North University Avenue, Ann Arbor, Michigan 48109, United States

2. Department of Macromolecular Science and Engineering, University of Michigan, 930 North University Avenue, Ann Arbor, Michigan 48109, United States

Funder

University of Michigan

Publisher

American Chemical Society (ACS)

Subject

Surfaces, Coatings and Films,Physical and Theoretical Chemistry,General Energy,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acs.jpcc.2c06096

Reference106 articles.

1. Adhesive wafer bonding

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3. Tuning the adhesion between polyimide substrate and MWCNTs/epoxy nanocomposite by surface treatment

4. Surface modification of ethylene-vinyl alcohol copolymer treated with plasma source ion implantation

5. Neat EVOH and EVOH/LDPE blend centered three-layer co-extruded blown film without tie layers

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