Effect of joining temperature on the interconnection zone and electrical resistance of Ag/n-Mg<sub>2</sub>Si and Ag/n-Mg<sub>2</sub>Sn contacts-Reference-Cited by-同舟云学术

Effect of joining temperature on the interconnection zone and electrical resistance of Ag/n-Mg₂Si and Ag/n-Mg₂Sn contacts

Published:2022 Issue:13 Volume:3 Page:5418-5429
ISSN:2633-5409
Container-title:Materials Advances
language:en
Short-container-title:Mater. Adv.

Author:

Deshpande Radhika¹^ORCID,Tumminello Silvana¹^ORCID,Ayachi Sahar¹,Mueller Eckhard¹²,de Boor Johannes¹³^ORCID

Affiliation:

1. Institute of Materials Research, German Aerospace Centre (DLR), Germany

2. Institute of Inorganic and Analytical Chemistry, Justus Liebig University of Giessen, Giessen, Germany

3. Institute of Technology for Nanostructures (NST), Faculty of Engineering, University of Duisburg-Essen, Germany

Abstract

1. Study of the Ag contacted n-type Mg2X (X = Si, Sn) TE materials. 2. Successful correlation of the observed phases at the n-Mg2X/Ag interconnection zones with the thermodynamically favorable phases. 3. Calculation of the electrical contact resistances.

Funder

Deutsche Forschungsgemeinschaft

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science,Chemistry (miscellaneous)

Link

http://pubs.rsc.org/en/content/articlepdf/2022/MA/D2MA00038E

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