Atomic layer deposition of Cu with a carbene-stabilized Cu(i) silylamide-Reference-Cited by-同舟云学术

Atomic layer deposition of Cu with a carbene-stabilized Cu(i) silylamide

Published:2014 Issue:43 Volume:2 Page:9205-9214
ISSN:2050-7526
Container-title:J. Mater. Chem. C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Hagen Dirk J.¹²³,Povey Ian M.¹²³,Rushworth Simon¹²³,Wrench Jacqueline S.¹²³,Keeney Lynette¹²³,Schmidt Michael¹²³,Petkov Nikolay¹²³,Barry Seán T.⁴⁵⁶,Coyle Jason P.⁴⁵⁶,Pemble Martyn E.¹²³⁴²

Affiliation:

1. Tyndall National Institute

2. University College Cork

3. , Ireland

4. Department of Chemistry

5. Carleton University

6. Ottawa, Canada

Abstract

The metal–organic Cu(i) complex 1,3-diisopropyl-imidazolin-2-ylidene copper hexamethyl disilazide has been tested as a novel oxygen-free precursor for atomic layer deposition of Cu with molecular hydrogen.

Funder

Science Foundation Ireland

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2014/TC/C4TC01418A

Reference83 articles.

1. Atomic Layer Deposition for CMOS Scaling: High-k Gate Dielectrics on Si, Ge, and III-V Semiconductors

2. Al2O3 Atomic Layer Deposition with Trimethylaluminum and Ozone Studied by in Situ Transmission FTIR Spectroscopy and Quadrupole Mass Spectrometry

3. Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process

4. Atomic layer deposition for photovoltaics: applications and prospects for solar cell manufacturing

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