Ab initio surface properties of Ag–Sn alloys: implications for lead-free soldering-Reference-Cited by-同舟云学术

Ab initio surface properties of Ag–Sn alloys: implications for lead-free soldering

Published:2018 Issue:6 Volume:20 Page:4277-4286
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Saleh Gabriele¹²³⁴^ORCID,Xu Chen⁵⁶⁷,Sanvito Stefano¹²³⁴

Affiliation:

1. School of Physics

2. AMBER and CRANN institute

3. Dublin 2

4. Ireland

5. Nokia Bell Labs

6. Murray Hill

7. USA

Abstract

Structure, stability and reactivity of silver–tin alloy surfaces revealed using DFT calculations and discussed in the framework of lead-free soldering.

Funder

H2020 Marie Skłodowska-Curie Actions

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2018/CP/C7CP07551K

Reference36 articles.

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3. Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

4. Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints

5. Corrosion behaviour assessment of lead-free Sn–Ag–M (M=In, Bi, Cu) solder alloys

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