Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method-Reference-Cited by-同舟云学术

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Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method

Published:2017 Issue:34 Volume:5 Page:8707-8713
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Zhang Xuan¹²³⁴⁵^ORCID,Zheng Xiujun¹²³⁴⁵,Zhang Hong¹²³⁴⁵,Zhang Junli¹²³⁴⁵,Fu Jiecai¹²³⁴⁵,Zhang Qiang⁶⁷⁸⁹,Peng Chaoyi¹⁰¹¹¹²⁵,Bai Feiming¹⁰¹¹¹²⁵,Zhang Xixiang⁶⁷⁸⁹^ORCID,Peng Yong¹²³⁴⁵

Affiliation:

1. Key Laboratory of Magnetism and Magnetic Materials of Ministry of Education

2. School of Physical Science and Technology

3. Lanzhou University

4. Lanzhou 730000

5. P. R. China

6. Division of Physical Science and Engineering

7. King Abdullah University of Science and Technology (KAUST)

8. Thuwal 239955

9. Kingdom of Saudi Arabia

10. State Key Laboratory of Electronic Thin Films and Integrated Devices

11. University of Electronic Science and Technology

12. Chengdu 610054

Abstract

Nanoscale semiconductor building blocks can be controllably soldered together via a novel in situ SEM-FIB thermal soldering technique.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2017/TC/C7TC01668A

Reference42 articles.

1. Ultra-thin 3D Nano-Devices from Atomic Layer Deposition on Polyimide

2. Nanowire Nanosensors for Highly Sensitive and Selective Detection of Biological and Chemical Species

3. Multi-functional nano-electronics constructed using boron phosphide and silicon carbide nanoribbons

4. Indium phosphide nanowires as building blocks for nanoscale electronic and optoelectronic devices

5. Electrochemically constructed p-Cu2O/n-ZnO heterojunction diode for photovoltaic device

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1. Rapid in situ wetting measurement for nanosolder by electron beam irradiation;Science and Technology of Welding and Joining;2022-12-19

2. In situ investigation on melting characteristics of 1D SnCu alloy nanosolder;Nanotechnology;2022-05-04

3. In-Situ Investigation on Melting Characteristics of 1d Sncu Alloy Nanosolder;SSRN Electronic Journal;2022

4. A novel 96.5Sn3Cu0.5Mn nanosolder with enhanced wettability applied to nanosoldering of WO3 nanomaterial;Nanotechnology;2019-02-28

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