Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites <i>via</i> incorporation of functionalized boron nitride-Reference-Cited by-同舟云学术

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Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites via incorporation of functionalized boron nitride

Published:2024 Issue:26 Volume:53 Page:10961-10973
ISSN:1477-9226
Container-title:Dalton Transactions
language:en
Short-container-title:Dalton Trans.

Author:

Lim Taeyoon¹,Yoo Jeseung¹,Park Hyuk¹,Ansar Sabah²^ORCID,Rabani Iqra¹^ORCID,Seo Young-Soo¹

Affiliation:

1. Department of Nanotechnology and Advanced Materials Engineering, Sejong University, Seoul 05006, Republic of Korea

2. Department of Clinical Laboratory Sciences, College of Applied Medical Sciences, King Saud University, P.O. Box 10219, Riyadh, 11433, Saudi Arabia

Abstract

Polymer-like dielectrics with superb thermal conductivity as well as high dielectric properties hold great promise for the modern electronic field.

Funder

Korea Institute of Energy Technology Evaluation and Planning

Ministry of Trade, Industry and Energy

King Saud University

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/DT/D4DT00979G

Reference67 articles.

1. Luffa/Epoxy Composites: Electrical Properties for PCB Application

2. Quasi-isotropically thermoconductive, antiwear and insulating hierarchically assembled hexagonal boron nitride nanosheet/epoxy composites for efficient microelectronic cooling

3. 3D hierarchical fireproof gel polymer electrolyte towards high-performance and comprehensive safety lithium-ion batteries

4. Deterministic Manipulation of Heat Flow via Three-Dimensional-Printed Thermal Meta-Materials for Multiple Protection of Critical Components

5. Visualization of Zika Virus Infection via a Light-Initiated Bio-Orthogonal Cycloaddition Labeling Strategy

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