Thermoelectric properties of copper chalcogenide alloys deposited via the solution-phase using a thiol–amine solvent mixture-Reference-Cited by-同舟云学术

Thermoelectric properties of copper chalcogenide alloys deposited via the solution-phase using a thiol–amine solvent mixture

Published:2016 Issue:102 Volume:6 Page:99905-99913
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Ma Yuanyu¹²³⁴,Vartak Prathamesh B.¹²³⁴,Nagaraj Prajwal¹²³⁴,Wang Robert Y.¹²³⁴

Affiliation:

1. School for Engineering of Matter, Transport & Energy

2. Arizona State University

3. Tempe

4. USA

Abstract

We use soluble precursors to deposit Cu_2−xSe_yS_1−y and Ag-doped Cu_2−xSe_yS_1−y thin films. We report the effects of Cu vacancies, Ag doping, and Se : S ratio on the thermoelectric properties at room temperature.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2016/RA/C6RA15929J

Reference51 articles.

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3. Nanostructured Thermoelectrics: Big Efficiency Gains from Small Features

4. Recent Developments in Semiconductor Thermoelectric Physics and Materials

5. High-performance bulk thermoelectrics with all-scale hierarchical architectures

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