Robust Ag nanoplate ink for flexible electronics packaging-Reference-Cited by-同舟云学术

Robust Ag nanoplate ink for flexible electronics packaging

Published:2015 Issue:16 Volume:7 Page:7368-7377
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Li Ruo-Zhou¹²³⁴⁵,Hu Anming⁶⁷⁸⁹¹⁰,Bridges Denzel⁶⁷⁸⁹¹⁰,Zhang Tong¹²³⁴⁵,Oakes Ken D.¹¹¹²¹³¹⁴,Peng Rui¹⁵¹⁶¹⁷,Tumuluri Uma¹⁵¹⁶¹⁷,Wu Zili¹⁵¹⁶¹⁷,Feng Zhili¹⁸¹⁹¹⁷

Affiliation:

1. School of Electronic Science and Engineering

2. Southeast University

3. Key Laboratory of Micro-Inertial Instrument and Advanced Navigation Technology

4. Ministry of Education

5. Nanjing 210096, China

6. Department of Mechanical

7. Aerospace

8. & Biomedical Engineering

9. University of Tennessee

10. Knoxville 37996, USA

11. Verschuren Centre

12. Department of Biology

13. Cape Breton University

14. Sydney, B1P 6L2 Canada

15. Center for Nanophase Materials Sciences and Chemical Science Division

16. Oak Ridge National Laboratory

17. Oak Ridge, USA

18. Materials Processing and Joining

19. Materials Science and Technology Division Oak Ridge National Laboratory

Abstract

We develop an innovative bonding using Ag nanoplates via photonic sintering with enhanced mechanical strength and anisotropic resistivity.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2015/NR/C5NR00312A

Reference43 articles.

1. Paper Electronics

2. Bendable Inorganic Thin-Film Battery for Fully Flexible Electronic Systems

3. Design optimized membrane-based flexible paper accelerometer with silver nano ink

4. Paper-based silver-nanowire electronic circuits with outstanding electrical conductivity and extreme bending stability

5. Transferred wrinkled Al2O3 for highly stretchable and transparent graphene–carbon nanotube transistors

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