Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement-Reference-Cited by-同舟云学术

Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

Published:2017 Issue:5 Volume:5 Page:1155-1164
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Li Wanli¹²³⁴⁵^ORCID,Zhang Hao¹²³⁴⁵,Gao Yue¹²³⁴⁵,Jiu Jinting⁶³⁷⁵,Li Cai-Fu⁶³⁷⁵,Chen Chuantong⁶³⁷⁵,Hu Dawei⁶³⁷⁵,Goya Yusuke¹²³⁴⁵,Wang Yutao⁸⁹¹⁰¹¹,Koga Hirotaka⁶³⁷⁵^ORCID,Nagao Shijo⁶³⁷⁵,Suganuma Katsuaki⁶³⁷⁵

Affiliation:

1. Department of Adaptive Machine Systems

2. Graduate School of Engineering

3. Osaka University

4. Suita

5. Japan

6. The Institute of Scientific and Industrial Research (ISIR)

7. Ibaraki

8. School of Physical Science

9. University of Science and Technology of China

10. Hefei

11. China

Abstract

An optimized two-step sintering process is developed to achieve highly reliable submicron Cu particle patterns on low-cost, transparent, and flexible substrates.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2017/TC/C6TC04892G

Reference55 articles.

1. Silver Nanowire Networks as Flexible, Transparent, Conducting Films: Extremely High DC to Optical Conductivity Ratios

2. Flexible transparent conductive coatings by combining self-assembly with sintering of silver nanoparticles performed at room temperature

3. Low-Cost Inorganic Solar Cells: From Ink To Printed Device

4. Scalable Coating and Properties of Transparent, Flexible, Silver Nanowire Electrodes

5. High-Resolution Thin-Film Device to Sense Texture by Touch

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