High dielectric permittivity and low loss tangent of polystyrene incorporated with hydrophobic core–shell copper nanowires
Author:
Affiliation:
1. Department of Physics and Materials Science
2. City University of Hong Kong
3. Hong Kong
Abstract
Core–shell copper nanowires for improving the dielectric performance of polystyrene.
Publisher
Royal Society of Chemistry (RSC)
Subject
General Chemical Engineering,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA04731E
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