Author:
Dang Zhi-Min,Yuan Jin-Kai,Zha Jun-Wei,Zhou Tao,Li Sheng-Tao,Hu Guo-Hua
Subject
General Materials Science
Reference309 articles.
1. Electronic packaging for high reliability, low cost electronics;Tummala,1999
2. Chip on board technologies for multichip modules;Lau,1994
3. Polymer–ceramic nanocomposites based on new concepts for embedded capacitor;Kakimoto;Mater Sci Eng B,2006
4. Evaluating the need for integrated passive substrates;Kapadia;Adv Microelectron,1999
5. Electroactive polymers as artificial muscles: a review;Bar-Cohen;J Spacecraft Rockets,2002
Cited by
1458 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献