Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Solder-based chip-to-tube and chip-to-chip packaging for microfluidic devices

Published:2007 Issue:10 Volume:7 Page:1309
ISSN:1473-0197
Container-title:Lab on a Chip
language:en
Short-container-title:Lab Chip

Author:

Murphy Edward R.,Inoue Tomoya,Sahoo Hemantkumar R.,Zaborenko Nikolay,Jensen Klavs F.

Publisher

Royal Society of Chemistry (RSC)

Subject

Biomedical Engineering,General Chemistry,Biochemistry,Bioengineering

Link

http://pubs.rsc.org/en/content/articlepdf/2007/LC/B704804A

Reference29 articles.

1. Macro-to-micro interfaces for microfluidic devices

2. Reliability aspects of packaging and integration technology for microfluidic systems

3. Silicon-Based Microchemical Systems: Characteristics and Applications

4. Microfabricated Multiphase Reactors for the Direct Synthesis of Hydrogen Peroxide from Hydrogen and Oxygen

5. Interconnected reversible lab-on-a-chip technology

Cited by 37 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental study on ultra-thin silicon-based VC for chip-level heat dissipation;Applied Thermal Engineering;2024-03

2. Investigation of deformation mechanism of SiC–CuNi composite thin film material nanochannels by molecular dynamics simulation;Results in Physics;2023-11

3. High-Pressure Microfluidics for Ultra-Fast Microbial Phenotyping;Frontiers in Microbiology;2022-05-23

4. Past, Present, and Future of Microfluidic Fluid Analysis in the Energy Industry;Energy & Fuels;2022-04-19

5. Characterization and Evaluation of 3D-Printed Connectors for Microfluidics;Micromachines;2021-07-26

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3