Investigation of deformation mechanism of SiC–CuNi composite thin film material nanochannels by molecular dynamics simulation
Author:
Publisher
Elsevier BV
Subject
General Physics and Astronomy
Reference59 articles.
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3. The effects of active elements on adhesion strength of SiC/Cu interface in SiC reinforced Cu-based composite: A first-principles investigation [J];Chen;Mater Today Commun,2022
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