Enhanced thermal conductivity of epoxy/three-dimensional carbon hybrid filler composites for effective heat dissipation-Reference-Cited by-同舟云学术

Enhanced thermal conductivity of epoxy/three-dimensional carbon hybrid filler composites for effective heat dissipation

Published:2015 Issue:58 Volume:5 Page:46989-46996
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Park Ji Sun¹²³⁴,An You Jin¹²³⁴,Shin Kwonwoo¹²³⁴,Han Jong Hun⁵⁶⁷⁴,Lee Churl Seung¹²³⁴

Affiliation:

1. Energy Nano Materials Research Center

2. Korea Electronics Technology Institute (KETI)

3. Seongnam 463-816

4. Republic of Korea

5. School of Applied Chemical Engineering

6. Chonnam National University

7. Gwangju 500-757

Abstract

A three-dimensional carbon-based heat-dissipating material was designed to improve the thermal conductivity of polymer composites in both the xy- and z-directions.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA05817A

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5. Heat Dissipation of Printed Circuit Board by the High Thermal Conductivity of Photo-Imageable Solder Resist

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