Integration of multi-scale defects for optimizing thermoelectric properties of n-type Cu1−xCdxFeS2 (x = 0–0.1)-Reference-Cited by-同舟云学术

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Integration of multi-scale defects for optimizing thermoelectric properties of n-type Cu1−xCdxFeS2 (x = 0–0.1)

Published:2019 Issue:37 Volume:11 Page:17340-17349
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Ge Bangzhi¹²³⁴,Hu Jiabin¹²³⁴,Shi Zhongqi¹²³⁴^ORCID,Wang Hailong⁵⁶⁷⁸⁴,Xia Hongyan¹²³⁴,Qiao Guanjun¹²³⁴⁹

Affiliation:

1. State Key Laboratory for Mechanical Behavior of Materials

2. Xi'an Jiaotong University

3. Xi'an 710049

4. China

5. Advanced Energy Storage Materials and Devices Lab

6. School of Physics and Electronic-Electrical Engineering

7. Ningxia University

8. Yinchuan

9. School of Materials Science and Engineering

Abstract

Illustration of integrating multi-scale defects for optimizing the thermoelectric properties of Cu_1−xCd_xFeS₂.

Funder

National Natural Science Foundation of China

State Key Laboratory for Mechanical Behavior of Materials

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2019/NR/C9NR04693C

Reference33 articles.

1. High Performance Thermoelectric Materials: Progress and Their Applications

2. Complex thermoelectric materials

3. Superior thermoelectric performance in PbTe–PbS pseudo-binary: extremely low thermal conductivity and modulated carrier concentration

4. Defect Engineering for High-Performance n-Type PbSe Thermoelectrics

5. General method of synthesis ultrathin ternary metal chalcogenide nanowires for potential thermoelectric applications

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2. Sulfur Vacancy-Driven Band Splitting and Phonon Anharmonicity Enhance the Thermoelectric Performance in n-Type CuFeS₂;ACS Applied Energy Materials;2024-02-27

3. Impact of Zn doping on the structural properties and thermoelectric performance of CuCr _0.85 Mg _(0.15-x) Zn _x O ₂ (x ≤ 0.05) delafossite materials;Advanced Composite Materials;2024-01-02

4. Approaching high thermoelectric performance in p-type Cu3SbS4-based materials by rational electronic and nano/microstructural engineering;Chemical Engineering Journal;2023-08

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