Laminated three-dimensional carbon nanotube integrated circuits-Reference-Cited by-同舟云学术

Laminated three-dimensional carbon nanotube integrated circuits

Published:2022 Issue:18 Volume:14 Page:7049-7054
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Jian Yang¹²,Sun Yun²³,Feng Shun²⁴,Zang Chao²³,Li Bo²³,Qiu Song⁵^ORCID,Li Qing-Wen⁵^ORCID,Yan Xin¹,Sun Dong-Ming²³^ORCID

Affiliation:

1. College of Information Science and Engineering, Northeastern University, 3-11 Wenhua Road, Shenyang, 110819, China

2. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang, 110016, China

3. School of Material Science and Engineering, University of Science and Technology of China, 72 Wenhua Road, Shenyang, 110016, China

4. School of Physical Science and Technology, ShanghaiTech University, 393 Huaxiazhong Road, Shanghai, 200031, China

5. Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, 398 Ruoshui Road, Suzhou, 215123, China

Abstract

An experimental prototype of new laminated 3D CNT integrated circuits by the layer-by-layer stacking of each component has been realized, benefiting from the stability of CNT devices using PTFE as a separator.

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Special Project for Research and Development in Key areas of Guangdong Province

Chinese Academy of Sciences

Key Research Program of Frontier Science, Chinese Academy of Sciences

Natural Science Foundation of Shandong Province

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

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