Facile preparation of a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding-Reference-Cited by-同舟云学术

Facile preparation of a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference shielding

Published:2017 Issue:48 Volume:5 Page:12769-12776
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Wang Yan¹²³⁴,Ni Li-juan¹²³⁴,Yang Fan¹²³⁴,Gu Fu-qiang¹²³⁴,Liang Kun⁵⁶⁷⁸^ORCID,Marcus Kyle⁵⁶⁷⁸,Wan Ya-dong¹²³⁴,Chen Jin-ju¹²³⁴^ORCID,Feng Zhe-sheng¹²³⁴

Affiliation:

1. State Key Laboratory of Electronic Thin Films and Integrated Devices

2. University of Electronic Science and Technology of China

3. Chengdu 610054

4. P. R. China

5. Nanoscience Technology Center

6. University of Central Florida

7. Orlando

8. USA

Abstract

A convenient and low-cost approach to fabricate a high-quality copper layer on epoxy resin via electroless plating for applications in electromagnetic interference (EMI) shielding is introduced in this paper.

Funder

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2017/TC/C7TC03823B

Reference45 articles.

1. Heterogeneous Three-Dimensional Electronics by Use of Printed Semiconductor Nanomaterials

2. Polypyrrole-interface-functionalized nano-magnetite epoxy nanocomposites as electromagnetic wave absorbers with enhanced flame retardancy

3. Multifunctional 3D nanoarchitectures for energy storage and conversion

4. Electromagnetic interference shielding with 2D transition metal carbides (MXenes)

5. Highly Aligned Graphene/Polymer Nanocomposites with Excellent Dielectric Properties for High-Performance Electromagnetic Interference Shielding

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