A model for the effect of ion pairing on an outer sphere electron transfer
Author:
Affiliation:
1. Kazan National Research Technological University
2. 420015 Kazan
3. Russian Federation
4. Instituto de Química Aplicada del Litoral
5. IQAL (UNL-CONICET)
6. Santa Fe
7. Argentina
8. Institute of Theoretical Chemistry
9. Ulm University
10. Germany
Abstract
Our theory for the effect of ion pairing on electron transfer explains why the chloride ion catalyses copper deposition.
Funder
Deutsche Forschungsgemeinschaft
Russian Foundation for Basic Research
Agencia Nacional de Promoción Científica y Tecnológica
Publisher
Royal Society of Chemistry (RSC)
Subject
Physical and Theoretical Chemistry,General Physics and Astronomy
Link
http://pubs.rsc.org/en/content/articlepdf/2020/CP/D0CP01915A
Reference46 articles.
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2. Electrodeposition of Copper in Modern Electroplating , ed. M. Schlesinger and M. Paunovic , Wiley , New York , 4th edn, 2000
3. Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements
4. Chloride Ion Catalysis of the Copper Deposition Reaction
5. A simple model for the kinetics of dissociative electron transfer in polar solvents. Application to the homogeneous and heterogeneous reduction of alkyl halides
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