A model for the effect of ion pairing on an outer sphere electron transfer

Author:

Nazmutdinov Renat123,Quaino Paola4567,Colombo Estefania4567,Santos Elizabeth8910,Schmickler Wolfgang8910ORCID

Affiliation:

1. Kazan National Research Technological University

2. 420015 Kazan

3. Russian Federation

4. Instituto de Química Aplicada del Litoral

5. IQAL (UNL-CONICET)

6. Santa Fe

7. Argentina

8. Institute of Theoretical Chemistry

9. Ulm University

10. Germany

Abstract

Our theory for the effect of ion pairing on electron transfer explains why the chloride ion catalyses copper deposition.

Funder

Deutsche Forschungsgemeinschaft

Russian Foundation for Basic Research

Agencia Nacional de Promoción Científica y Tecnológica

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Reference46 articles.

1. J. W. Dini , Electrodeposition, The Materials Science of Coatings and Substrates , Noyes Publications , 1993

2. Electrodeposition of Copper in Modern Electroplating , ed. M. Schlesinger and M. Paunovic , Wiley , New York , 4th edn, 2000

3. Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements

4. Chloride Ion Catalysis of the Copper Deposition Reaction

5. A simple model for the kinetics of dissociative electron transfer in polar solvents. Application to the homogeneous and heterogeneous reduction of alkyl halides

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