An anti-leakage liquid metal thermal interface material-Reference-Cited by-同舟云学术

An anti-leakage liquid metal thermal interface material

Published:2020 Issue:32 Volume:10 Page:18824-18829
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Huang Kaiyuan¹²³^ORCID,Qiu Wangkang¹²³,Ou Meilian¹²³^ORCID,Liu Xiaorui⁴⁵³,Liao Zenan⁶⁷³,Chu Sheng¹²³^ORCID

Affiliation:

1. State Key Laboratory of Optoelectronic Materials and Technologies

2. Sun Yat-Sen University

3. China

4. Huwei Technologies Co., Ltd

5. Shenzhen 518129

6. Guangtai Technology Co., Ltd

7. Dongguan 523590

Abstract

An improved form of LM/indium film/LM sandwich pad with surface micropillar arrays is a high-performance thermal interface material for thermal management.

Funder

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2020/RA/D0RA02351E

Reference30 articles.

1. Thermal model design and analysis of the high-power LED automotive headlight cooling device

2. Challenges in Cooling Design of CPU Packages for High-Performance Servers

3. Thermal management of electronic devices using carbon foam and PCM/nano-composite

4. F.Sarvar , D. C.Whalley , and P. P.Conway , Proc. 1st IEEE Electronic Systemintegration Technology Conference , 2006 , p. 1292

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