Direct fabrication of BiFeO3 thin films on polyimide substrates for flexible electronics-Reference-Cited by-同舟云学术

Direct fabrication of BiFeO3 thin films on polyimide substrates for flexible electronics

Published:2017 Issue:47 Volume:5 Page:12529-12537
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Tomczyk Monika¹²³⁴⁵^ORCID,Bretos Iñigo⁶⁷⁸⁹^ORCID,Jiménez Ricardo⁶⁷⁸⁹^ORCID,Mahajan Amit¹⁰¹¹¹²¹³,Ramana E. Venkata¹⁴¹⁵³⁴⁵,Calzada M. Lourdes⁶⁷⁸⁹^ORCID,Vilarinho Paula M.¹²³⁴⁵^ORCID

Affiliation:

1. CICECO-Aveiro Institute of Materials

2. Department of Ceramics and Glass Engineering

3. University of Aveiro

4. 3810-193 Aveiro

5. Portugal

6. Instituto de Ciencia de Materiales de Madrid

7. Consejo Superior de Investigaciones Científicas (ICMM-CSIC)

8. Cantoblanco

9. Spain

10. School of Engineering and Material Science

11. Queen Mary University of London

12. London

13. UK

14. I3N-Aveiro

15. Department of Physics

Abstract

The Seeded Photosensitive Precursor Method was successfully used for integration of lead-free BiFeO₃ ferroelectric thin films with flexible plastic substrates at temperatures as low as 300 °C.

Funder

Fundação para a Ciência e a Tecnologia

Fundación General CSIC

European Cooperation in Science and Technology

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2017/TC/C7TC04571A

Reference58 articles.

1. Flexible Electronics: The Next Ubiquitous Platform