Solvent-assisted delamination of layered copper dithienothiophene-dicarboxylate (DUT-134)-Reference-Cited by-同舟云学术

Solvent-assisted delamination of layered copper dithienothiophene-dicarboxylate (DUT-134)

Published:2021 Issue: Volume: Page:
ISSN:2052-1553
Container-title:Inorganic Chemistry Frontiers
language:en
Short-container-title:Inorg. Chem. Front.

Author:

Schwotzer Friedrich¹²³⁴⁵,Senkovska Irena¹²³⁴⁵^ORCID,Bon Volodymyr¹²³⁴⁵^ORCID,Lochmann Stefanie¹²³⁴⁵,Evans Jack D.¹²³⁴⁵^ORCID,Pohl Darius⁶⁷³⁴⁵,Rellinghaus Bernd⁶⁷³⁴⁵,Kaskel Stefan¹²³⁴⁵^ORCID

Affiliation:

1. Inorganic Chemistry I

2. Faculty of Chemistry and Food Chemistry

3. Technische Universität Dresden

4. 01069 Dresden

5. Germany

6. Dresden Center for Nanoanalysis (DCN)

7. Center for advancing electronics Dresden

Abstract

Rational selection of the delamination solvent enables efficient exfoliation of layered MOF, resulting in suspension of the nanosheets stable over days.

Funder

Bundesministerium für Bildung und Forschung

Deutsche Forschungsgemeinschaft

Publisher

Royal Society of Chemistry (RSC)

Subject

Inorganic Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2021/QI/D1QI00349F

Reference35 articles.

1. Balancing Mechanical Stability and Ultrahigh Porosity in Crystalline Framework Materials

2. A new metal–organic framework with ultra-high surface area