Tuning thermal contact conductance at graphene–copper interfaceviasurface nanoengineering-Reference-Cited by-同舟云学术

Tuning thermal contact conductance at graphene–copper interfaceviasurface nanoengineering

Published:2015 Issue:14 Volume:7 Page:6286-6294
ISSN:2040-3364
Container-title:Nanoscale
language:en
Short-container-title:Nanoscale

Author:

Hong Yang¹²³,Li Lei¹²³,Zeng Xiao Cheng¹²³,Zhang Jingchao⁴²³

Affiliation:

1. Department of Chemistry

2. University of Nebraska-Lincoln

3. Lincoln, USA

4. Holland Computing Center

Abstract

By introducing a surface nanoengineering design at sub-nm level, the thermal contact resistance between graphene and copper is reduced by 17% due to enhanced phonon couplings across the interface.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science

Link

http://pubs.rsc.org/en/content/articlepdf/2015/NR/C5NR00564G

Reference51 articles.

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4. Thermal contact resistance between graphene and silicon dioxide

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