Elastic and inelastic phonon scattering effects on thermal conductance across Au/graphene/Au interface

Author:

Chen Weiyu12ORCID,Zhou Quan1,Han Quan1ORCID,Liu Chenhan3ORCID,Jiang Xinchi1,Gu Yunfeng1ORCID,Wu Gensheng1ORCID,Zhang Yan2,Wei Zhiyong2ORCID,Chen Yunfei2ORCID

Affiliation:

1. College of Mechanical and Electronic Engineering, Nanjing Forestry University 1 , Nanjing 210037, Peoples’s Republic of China

2. School of Mechanical Engineering and Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Southeast University 2 , Nanjing 210096, Peoples’s Republic of China

3. Engineering Laboratory for Energy System Process Conversion & Emission Reduction Technology of Jiangsu Province, School of Energy and Mechanical Engineering, Nanjing Normal University 3 , Nanjing 210042, Peoples’s Republic of China

Abstract

Heat dissipation from graphene devices is predominantly limited by heat conduction across the metal contacts with complex phonon scattering. In this work, the effects of elastic and inelastic phonon scattering on the interfacial thermal conductance (ITC) across the Au/graphene/Au interface are studied using both atomistic Green's function (AGF) and reverse non-equilibrium molecular dynamics methods. The results show that the contribution of inelastic phonon scattering to the ITC increases with the enhancement of interfacial bonding strength. Moreover, the overlap of the vibrational density of states across the interface shows that the coupling between the Au layer (adjacent to the Au/graphene interface) and graphene's out-of-plane modes plays the dominant role in ITC across the Au/graphene interface. By comparing the transmission functions calculated with AGF and spectral heat current decomposition methods, the inelastic phonon scattering process facilitates phonon transmission in the lower and higher frequency range but hinders phonon transmission in the intermediate frequency range. It is expected that this study can contribute to a better understanding of the thermal conduction mechanism across the metal/graphene interface, providing guidance for thermal management and heat conduction optimization of graphene in microelectronic devices.

Publisher

AIP Publishing

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