Mechanical regulation to interfacial thermal transport in GaN/diamond heterostructures for thermal switch-Reference-Cited by-同舟云学术

Mechanical regulation to interfacial thermal transport in GaN/diamond heterostructures for thermal switch

Published:2024 Issue:9 Volume:9 Page:1557-1567
ISSN:2055-6756
Container-title:Nanoscale Horizons
language:en
Short-container-title:Nanoscale Horiz.

Author:

Yu Xiaotong¹^ORCID,Li Yifan¹,He Renjie¹,Wen Yanwei²^ORCID,Chen Rong¹,Xu Baoxing³^ORCID,Gao Yuan¹^ORCID

Affiliation:

1. State Key Laboratory of Digital Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China

2. State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China

3. Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA 22904, USA

Abstract

The conceptual design of a mechanical thermal switch is enabled by the mechanically tunable thermal conduction at the junction of the GaN/diamond heterostructure.

Funder

National Key Research and Development Program of China

National Outstanding Youth Science Fund Project of National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Link

http://pubs.rsc.org/en/content/articlepdf/2024/NH/D4NH00245H

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