Long-term reliability of silicon wafer-based traditional backsheet modules and double glass modules-Reference-Cited by-同舟云学术

Long-term reliability of silicon wafer-based traditional backsheet modules and double glass modules

Published:2015 Issue:81 Volume:5 Page:65768-65774
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Zhang Yingbin¹²³⁴⁵,Xu Jianmei⁶⁷⁸⁹,Mao Jing⁶⁷⁸⁹,Tao Jiahua¹²³⁴⁵,Shen Hui⁶⁷⁸⁹,Chen Yifeng⁶⁷⁸⁹,Feng Zhiqiang⁶⁷⁸⁹,Verlinden Pierre J.⁶⁷⁸⁹,Yang Pingxiong¹²³⁴⁵,Chu Junhao¹²³⁴⁵

Affiliation:

1. Key Laboratory of Polar Materials and Devices

2. Ministry of Education

3. Department of Electronic Engineering

4. East China Normal University

5. Shanghai 200241

6. State Key Laboratory of PV Science and Technology

7. Changzhou Trina Solar Energy Co., Ltd.

8. Changzhou

9. China

Abstract

An extensive program of series extended sequential long-term reliability stress including TC 600, DH 3000, 600 hours PID and HF 50 were performed on silicon wafer-based traditional backsheet modules and double glass PV modules.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2015/RA/C5RA11224A

Reference21 articles.

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