Author:
Park Nochang,Jeong Jaeseong,Han Changwoon
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. A damage integral approach to thermal fatigue of solder joints;Subrahmanyan;Compo, Hybrids, Manuf Technol, IEEE Trans,1989
2. Applied photovoltaics;Wenham,2011
3. Morita K, Inoue T, Kato H, Tsuda I, Hishikawa Y. Degradation factor analysis of crystalline-Si PV modules through long-term field exposure test. In: Proceedings of 3rd World Conference, IEEE 2003. p. 1948–51.
4. Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells, progress in photovoltaics;Cuddalorepatta;Res Appl,2010
5. Wohlgemuth JH, Cunningham DW, Monus P, Miller J, Nguyen A. Long term reliability of photovoltaic modules. In: Conference Record of 4th World Conference, IEEE 2006. p. 2050–53.
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