Ultra-low dielectric closed porous materials via incorporating surface-functionalized hollow silica microspheres: preparation, interface property and low dielectric performance-Reference-Cited by-同舟云学术

Ultra-low dielectric closed porous materials via incorporating surface-functionalized hollow silica microspheres: preparation, interface property and low dielectric performance

Published:2016 Issue:3 Volume:6 Page:1870-1876
ISSN:2046-2069
Container-title:RSC Advances
language:en
Short-container-title:RSC Adv.

Author:

Wei Xiaonan¹²³⁴,Zhao Cuijiao¹²³⁴,Ma Jiajun¹²³⁴,Huang Yawen¹²³⁴,Cao Ke¹²³⁴,Chang Guanjun¹²³⁴,Yang Junxiao¹²³⁴

Affiliation:

1. State Key Laboratory Cultivation Base for Nonmetal Composite and Functional Materials

2. Southwest University of Science and Technology

3. Mianyang

4. China

Abstract

One effective route to reduce the dielectric constant is to directly incorporate hollow silica (HoSiO₂) microspheres into a polymeric matrix.

Publisher

Royal Society of Chemistry (RSC)

Subject

General Chemical Engineering,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2016/RA/C5RA21886A

Reference32 articles.

1. Low Dielectric Constant Materials

2. Cavitated Block Copolymer Micellar Thin Films: Lateral Arrays of Open Nanoreactors

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4. Synthesis of Doped ZnS Nanoclusters within Block Copolymer Nanoreactors

5. Synthesis of zinc sulfide clusters and zinc particles within microphase-separated domains of organometallic block copolymers

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