Competing failure modes in finite adhesive pads-Reference-Cited by-同舟云学术

Competing failure modes in finite adhesive pads

Published:2018 Issue:10 Volume:14 Page:1771-1779
ISSN:1744-683X
Container-title:Soft Matter
language:en
Short-container-title:Soft Matter

Author:

Cohen Tal¹²³⁴⁵,Chan Chon U¹²³⁴^ORCID,Mahadevan L.¹²³⁴⁶^ORCID

Affiliation:

1. Paulson School of Engineering and Applied Sciences

2. Harvard University

3. Cambridge

4. USA

5. Department of Mechanical Engineering

6. Departments of Organismic and Evolutionary Biology, and Physics

Abstract

Thin adhesive pads used to attach objects to each other often fail catastrophically. In this study we consider the nature of failure of such pads and show that two different peeling mechanisms emerge.

Funder

Division of Materials Research

National Science Foundation

Army Research Office

John D. and Catherine T. MacArthur Foundation

Agency for Science, Technology and Research

Publisher

Royal Society of Chemistry (RSC)

Subject

Condensed Matter Physics,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2018/SM/C7SM02378B

Reference42 articles.

1. Scaling and biomechanics of surface attachment in climbing animals

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3. Adhesional instabilities and gecko locomotion

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