Heat conduction of electrons and phonons in thermal interface materials-Reference-Cited by-同舟云学术

Heat conduction of electrons and phonons in thermal interface materials

Author:

Zhao Yunshan¹²³⁴,Zeng Xiangliang⁵⁶⁷⁸⁴^ORCID,Ren Linlin⁵⁶⁷⁸⁴,Xia Xinnian⁹¹⁰¹¹⁴^ORCID,Zeng Xiaoliang⁵⁶⁷⁸⁴^ORCID,Zhou Jun¹²³⁴^ORCID

Affiliation:

1. NNU-SULI Thermal Energy Research Center & Center for Quantum Transport and Thermal Energy Science

2. Nanjing Normal University

3. Nanjing 210023

4. China

5. Shenzhen Institute of Advanced Electronic Materials

6. Shenzhen Institutes of Advanced Technology

7. Chinese Academy of Sciences

8. Shenzhen 518055

9. College of Chemistry and Chemical Engineering

10. Hunan University

11. Changsha 410082

Abstract

Investigation on the thermal transport of heat carriers in TIMs will aid in promoting the advancement of TIMs with high performance.

Funder

National Natural Science Foundation of China

Youth Innovation Promotion Association of the Chinese Academy of Sciences

National Key Research and Development Program of China

Department of Education of Guangdong Province

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Materials Science

Link

Reference176 articles.

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