Plasma free reversible and irreversible microfluidic bonding
Author:
Affiliation:
1. Department of Biomedical Engineering
2. University of California
3. Irvine
4. USA
5. Department of Chemical Engineering
Abstract
We demonstrate a novel bonding process that allows for facile multilayer microfluidic chip fabrication and is compatible with cell micropatterning.
Funder
National Science Foundation
Publisher
Royal Society of Chemistry (RSC)
Subject
Biomedical Engineering,General Chemistry,Biochemistry,Bioengineering
Link
http://pubs.rsc.org/en/content/articlepdf/2017/LC/C6LC01338D
Reference31 articles.
1. The present and future role of microfluidics in biomedical research
2. Plasma treatment of polydimethylsiloxane
3. PDMS bonding by means of a portable, low-cost corona system
4. Construction of microfluidic chips using polydimethylsiloxane for adhesive bonding
5. A facile route for irreversible bonding of plastic-PDMS hybrid microdevices at room temperature
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Review on bonding strength testing methods for polymer-based microfluidics;Journal of Adhesion Science and Technology;2024-05-27
2. Reversibly-bonded microfluidic devices for stable cell culture and rapid, gentle cell extraction;Lab on a Chip;2024
3. Reversibly-bonded Microfluidic Devices for Stable Cell Culture and Rapid, Gentle Cell Extraction;2023-12-08
4. Irreversible PDMS bonding using flame activation of adhesives for fabrication of microfluidic and organ-on-chip devices;Materials Letters;2023-12
5. Irreversible PDMS bonding using flame activation of adhesives for fabrication of microfluidic and organ-on-chip devices;2023-08-19
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3