Thermal conductivity reduction by nanostructuration in electrodeposited CuNi alloys-Reference-Cited by-同舟云学术

Thermal conductivity reduction by nanostructuration in electrodeposited CuNi alloys

Published:2021 Issue:10 Volume:9 Page:3447-3454
ISSN:2050-7526
Container-title:Journal of Materials Chemistry C
language:en
Short-container-title:J. Mater. Chem. C

Author:

Manzano Cristina V.¹²³⁴⁵^ORCID,Caballero-Calero Olga⁴⁵⁶^ORCID,Tranchant Maxime¹²³,Bertero Enrico¹²³,Cervino-Solana Pablo⁴⁵⁶^ORCID,Martin-Gonzalez Marisol⁴⁵⁶^ORCID,Philippe Laetitia¹²³^ORCID

Affiliation:

1. Empa, Swiss Faederal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures

2. CH-3602 Thun

3. Switzerland

4. Instituto de Micro y Nanotecnología, IMN-CNM, CSIC (CEI UAM+CSIC) Isaac Newton

5. Tres Cantos

6. Spain

Abstract

The thermal conductivity of CuNi alloys grown by pulsed electrodeposition is reduced by the nanostructuration to a value of 9.0 ± 0.9 W m⁻¹ K⁻¹ due to the incorporation of saccharine in the electrolyte which allowed reduction of the crystallite size.

Funder

Consejo Superior de Investigaciones Científicas

Ministerio de Economía y Competitividad

European Regional Development Fund

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2021/TC/D1TC00307K

Reference39 articles.

1. Nanocrystalline Electroplated Cu-Ni: Metallic Thin Films with Enhanced Mechanical Properties and Tunable Magnetic Behavior