Binder-free bonding of modularized MXene thin films into thick film electrodes for on-chip micro-supercapacitors with enhanced areal performance metrics-Reference-Cited by-同舟云学术

Binder-free bonding of modularized MXene thin films into thick film electrodes for on-chip micro-supercapacitors with enhanced areal performance metrics

Published:2018 Issue:30 Volume:6 Page:14876-14884
ISSN:2050-7488
Container-title:Journal of Materials Chemistry A
language:en
Short-container-title:J. Mater. Chem. A

Author:

Hu Haibo¹²³⁴⁵^ORCID,Bai Zhiman¹²³⁴,Niu Ben⁵⁶⁷⁸⁹,Wu Mingzai¹²³⁴,Hua Tao⁵⁶⁷⁸⁹

Affiliation:

1. School of Physics and Materials Science

2. Anhui University

3. Hefei

4. China

5. Nanotechnology Center

6. Institute of Textiles & Clothing

7. The Hong Kong Polytechnic University

8. Kowloon

9. Hong Kong

Abstract

An efficient and easily-manipulated protocol was developed to prepare binder/conductive-additives free thick MXene film electrodes through bonding the modularized thin films only with water. The thickness can be multiplied by increasing the number of superposed modularized thin MXene films.

Funder

National Natural Science Foundation of China

Hong Kong Polytechnic University

Publisher

Royal Society of Chemistry (RSC)

Subject

General Materials Science,Renewable Energy, Sustainability and the Environment,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2018/TA/C8TA04737E

Reference53 articles.

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2. Nanotechnology-Enabled Energy Harvesting for Self-Powered Micro-/Nanosystems