Simple and convenient mapping of molecular dynamics mechanical property predictions of bisphenol-F epoxy for strain rate, temperature, and degree of cure
Author:
Affiliation:
1. Michigan Technological University, Houghton, MI-49931, USA
2. University of Massachusetts, Lowell, MA-01854, USA
Abstract
Funder
National Aeronautics and Space Administration
Directorate for Engineering
Publisher
Royal Society of Chemistry (RSC)
Subject
Condensed Matter Physics,General Chemistry
Link
http://pubs.rsc.org/en/content/articlepdf/2023/SM/D3SM00697B
Reference69 articles.
1. Physical aging of epoxy polymers and their composites
2. The effects of competitive primary and secondary amine reactivity on the structural evolution and properties of an epoxy thermoset resin during cure: A molecular dynamics study
3. Molecular dynamics simulations of EPON-862/DETDA epoxy networks: structure, topology, elastic constants, and local dynamics
4. Molecular dynamics predictions of thermal and mechanical properties of thermoset polymer EPON862/DETDA
5. Molecular scale simulations on thermoset polymers: A review
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Multiscale Process Modeling of Semicrystalline PEEK for Tailored Thermomechanical Properties;ACS Applied Engineering Materials;2023-11-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3