Simple and convenient mapping of molecular dynamics mechanical property predictions of bisphenol-F epoxy for strain rate, temperature, and degree of cure-Reference-Cited by-同舟云学术

Simple and convenient mapping of molecular dynamics mechanical property predictions of bisphenol-F epoxy for strain rate, temperature, and degree of cure

Published:2023 Issue:35 Volume:19 Page:6731-6742
ISSN:1744-683X
Container-title:Soft Matter
language:en
Short-container-title:Soft Matter

Author:

Patil Sagar U.¹^ORCID,Krieg Aaron S.¹^ORCID,Odegard Leif K.¹,Yadav Upendra¹,King Julia A.¹,Maiaru Marianna²,Odegard Gregory M.¹^ORCID

Affiliation:

1. Michigan Technological University, Houghton, MI-49931, USA

2. University of Massachusetts, Lowell, MA-01854, USA

Abstract

Mapping procedure to relate MD predictions to expected laboratory-scale observations considering the corresponding time scale and strain rate discrepancy.

Funder

National Aeronautics and Space Administration

Directorate for Engineering

Publisher

Royal Society of Chemistry (RSC)

Subject

Condensed Matter Physics,General Chemistry

Link

http://pubs.rsc.org/en/content/articlepdf/2023/SM/D3SM00697B

Reference69 articles.

1. Physical aging of epoxy polymers and their composites

2. The effects of competitive primary and secondary amine reactivity on the structural evolution and properties of an epoxy thermoset resin during cure: A molecular dynamics study