Molecular dynamics predictions of thermal and mechanical properties of thermoset polymer EPON862/DETDA
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference34 articles.
1. Competitive primary amine/epoxy and secondary amine/epoxy reactions: Effect on the isothermal time-to-vitrify
2. A relationship between the glass transition temperature (Tg) and fractional conversion for thermosetting systems
3. Glass-transition temperature-conversion relationship for an epoxy-hexahydro-4-methylphthalic anhydride system
4. Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4?-diaminodiphenylmethane
5. Modeling the evolution of the dynamic mechanical properties of a commercial epoxy during cure after gelation
Cited by 233 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Development of a multistep-GRRM/MC/MD simulation method for the formation of crosslinked network structures via multistep reversible reaction pathways;Polymer;2024-01
2. Development of cat-GRRM/MC/MD method for the simulation of cross-linked network structure formation with molecular autocatalysis;Molecular Catalysis;2024-01
3. Mechanical and chemical characterization of contemporary occlusal splint materials fabricated with different methods: a systematic review;Clinical Oral Investigations;2023-11-01
4. Tensile Stress Reduction and Strain Concentration of Epoxy Resin Caused by Heterogeneity: A Multiscale Approach Combining Molecular Dynamics Simulation and Finite Element Method;The Journal of Physical Chemistry B;2023-10-16
5. Evolution of Glassy Carbon Derived from Pyrolysis of Furan Resin;ACS Applied Engineering Materials;2023-10-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3