Construction of molecular regular tessellations on a Cu(111) surface-Reference-Cited by-同舟云学术

Construction of molecular regular tessellations on a Cu(111) surface

Published:2018 Issue:51 Volume:54 Page:7010-7013
ISSN:1359-7345
Container-title:Chemical Communications
language:en
Short-container-title:Chem. Commun.

Author:

Tao Zhijie¹²³⁴,Wang Tao¹²³⁴,Wu Daoxiong⁵⁶⁷²³,Feng Lin¹²³⁴,Huang Jianmin¹²³⁴,Wu Xiaojun⁵⁶⁷²³^ORCID,Zhu Junfa¹²³⁴^ORCID

Affiliation:

1. National Synchrotron Radiation Laboratory and Department of Chemical Physics

2. University of Science and Technology of China

3. Hefei

4. China

5. CAS Key Laboratory of Materials for Energy Conversion

6. School of Chemistry and Materials Science

7. Synergetic Information of Quantum Information & Quantum Technology, and CAS Center for Excellence in Nanoscience

Abstract

Through thermal treatment, three regular molecular tessellations are constructed on Cu(111) with a linear DOD precursor.

Funder

Ministry of Science and Technology of the People's Republic of China

National Natural Science Foundation of China

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,General Chemistry,Ceramics and Composites,Electronic, Optical and Magnetic Materials,Catalysis

Link

http://pubs.rsc.org/en/content/articlepdf/2018/CC/C8CC01719K

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5. Site percolation thresholds for Archimedean lattices

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