Solder Joint Reliability of Electroless Pd/Au Plating Film Formed with Co Activation-Reference-Cited by-同舟云学术

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Solder Joint Reliability of Electroless Pd/Au Plating Film Formed with Co Activation

Published:2021-12-01 Issue:12 Volume:72 Page:707-709
ISSN:0915-1869
Container-title:Journal of The Surface Finishing Society of Japan
language:en
Short-container-title:Journal of the Surface Finishing Society of Japan

Author:

SETO Hiroki¹,HASHIZUME Kei¹,TANAKA Katsuyuki¹

Affiliation:

1. Okuno Chemical Industries Co., Ltd.

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/72/12/72_707/_pdf

Reference4 articles.

1. 1）K. Yamamoto, H. Akahoshi, T. Kurashina, Y. Nozawa, R. Kimoto ; Proceedings of the 14th Micro-electronics Symposium 2004, p.77（Japan Institute of Electro Packaging, 2004）.

2. 2）Y. Tanabe, Y. Yamada, T. Shimoji, T. Matsunami, ; Proceedings of the 22nd JIEP Annual Meeting March 2008, p.153（Japan Institute of Electro Packaging, 2008）.

3. 3）K. kudou, Y. Tanabe, T. Shimoji, H. Nawafune ; Proceedings of the 23rd JIEP Annual Meeting March 2009, p.27（Japan Institute of Electro Packaging, 2009）.

4. 4）Y. Oda ; J. Surf. Finish. Soc. Jpn, 66, 453（2015）.

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