Recent Trend of Electroless Palladium Plating-Reference-Cited by-同舟云学术

Recent Trend of Electroless Palladium Plating

Published:2015 Issue:10 Volume:66 Page:453-457
ISSN:0915-1869
Container-title:Journal of the Surface Finishing Society of Japan
language:en
Short-container-title:Journal of The Surface Finishing Society of Japan

Author:

ODA Yukinori¹

Affiliation:

1. C. Uyemura & Co.,Ltd.

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/66/10/66_453/_pdf

Reference6 articles.

1. 1) C.-W. Hwang, K. Suganuma ; J. Mater. Res., 18, 2540 (2003).

2. Electroless Palladium Plating from Ethylenediamine Complex Bath Using Formic Acid as a Reducing Agent.

3. Electroless Plating. Electroless Palladium Plating and Its Applications.

4. 8) Y. Oda, M. Kiso, A. Okada, K. Kitajima, S. Hashimoto, G. Milad, D. Gudeczauskas ; 41st International Symposium on Microelectronics, Providence, RI, Nov (2008).

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