Plasma-induced Surface Modification of Fluoropolymer Films for Direct Adhesion with Copper-Reference-Cited by-同舟云学术

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Plasma-induced Surface Modification of Fluoropolymer Films for Direct Adhesion with Copper

Published:2021-06-01 Issue:6 Volume:72 Page:333-339
ISSN:0915-1869
Container-title:Journal of The Surface Finishing Society of Japan
language:en
Short-container-title:Journal of the Surface Finishing Society of Japan

Author:

KOBAYASHI Yasuyuki¹,IKEDA Shingo¹

Affiliation:

1. Osaka Research Institute of Industrial Science and Technology

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Link

https://www.jstage.jst.go.jp/article/sfj/72/6/72_333/_pdf

Reference33 articles.

1. 1）細田朋也 ; 5G対応に向けた部材・材料・デバイス設計開発指針, p.104（情報機構, 2019）.

2. 2）林　秀臣, 青木正光 ; エレクトロニクス実装学会誌, 22, 2（2021）.

3. 3）配線板製造技術委員会 ; エレクトロニクス実装学会誌, 20, 15（2017）.

4. 4）池田慎吾, 小泉　剛, 古川勝紀, 小林靖之 ; 第29回マイクロエレクトロニクスシンポジウム論文集, p.275（2019）.

5. 5）池田慎吾, 小林靖之 ; 表面技術, 71, 775（2020）.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Soft X-ray microspectroscopic imaging studies of exfoliated surface between fluoropolymer and Cu plate directly bonded by plasma irradiation with ammonia gas;Journal of Electron Spectroscopy and Related Phenomena;2023-08

2. Improvement of Adhesiveness of Cu Films on a PTFE Surface Irradiated with Low-Angle N<sup>+</sup> Ion Beam;IEEJ Transactions on Fundamentals and Materials;2023-07-01

3. Direct adhesion between Cu foil and polytetrafluoroethylene without increasing surface roughness for high-frequency printed wiring boards;RSC Advances;2023

4. Metallization of Syndiotactic Polystyrene Resin through Plasma Sputtering;Journal of The Surface Finishing Society of Japan;2023-01-01

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