10.4139/sfj.55.651

Author:

WATANABE Hideto

Publisher

The Surface Finishing Society of Japan

Subject

General Engineering

Reference10 articles.

1. Special Issue/The Present and Future Trends in the Electroless Plating. The Present and Future Trends in the Electroless Palladium Plating.

2. 2) 本間英夫, 進藤義朗, 高木道則;プリント回路学会誌, 7, 263 (1992)

3. 3) 古田博文, 吉川翔子, 城戸靖彦, 縄舟秀美;プリント回路学会誌, 8, 539 (1993)

4. Electroless plating of Pd-P alloys from ethylenediamine complex solutions.

5. 5) 芳賀正記, 内田 衛, 水本省三, 縄舟秀美;表面技術, 42, 90 (1991)

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1. Electroless Precious Metal Plating;Journal of The Surface Finishing Society of Japan;2019-09-01

2. Preparation of Electrodeposited Pd-Ni-P Metallic Glass Films and the Effect of Bath Concentration on Film Composition;Journal of the Surface Finishing Society of Japan;2012

3. 10.4139/sfj.62.387;Journal of The Surface Finishing Society of Japan;2011

4. Influences of Electroless Nickel Film Conditions on Electroless Au/Pd/Ni Wire Bondability;Transactions of The Japan Institute of Electronics Packaging;2010

5. 10.4139/sfj.58.109;Journal of The Surface Finishing Society of Japan;2007

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